Microdispensing System – MDS 3280
Highly flexible piezo system with stable coupling of wet and dry zones allows for easy, tool-free maintenance and cleaning.
The MDS 3280 sets new standards in microdispensing. Featuring a unique Bayonet Fluid Box Body with integrated heating, top adjust for quick setup, and high-speed piezo technology, it adapts perfectly to various media. Compact design ensures seamless integration, easy cleaning, and maximum application flexibility.
| Dispensing quantity | Min. 0.5 nL per pulse (depending on media) |
| Minimum droplet diameter | 150 µm |
| Supply pressure | 1 - 8 bar (rel.), max. 100 bar (only when pressure tank is used) |
| Frequency | Up to 2,000 Hz (depending on media) |
| Dispensing viscosity | Up to 2,000,000 mPas |
| Optional heating system | Regulated nozzle heating up to 180 °C (higher temperature upon request) |
| Standard interface | RS 232 C; PLC 24 V /5 V, AUX |
| Valve type | Top Adjust, Normally open |
| Dimensions | Valve MDV 3280: 92.1 mm H x 41.5 mm W x 36.5 mm D (including air cooling) Control unit MDC 3290+: 128 mm H x 102 mm W x 173 mm D (without cables), for installation in 19" racks |
| Weight | Valve: 250 g, Controller: 1350 g |
| Power connection | 110/230 V AC, 50/60 Hz power socket (on the back side) |
- Ultra-Precise Contact-Free Dispensing: Based on proven piezoelectric actuator technology, enabling consistent, repeatable micro-droplet dispensing without substrate contact.
- Innovative Bayonet Fluid Box Body: Screw-less, one-click connection allows fast removal, easy cleaning, and minimal downtime.
- Highest Performance & Cost-Effective Productivity: Advanced valve design ensures uniform, reproducible droplets while improving throughput and reducing production costs.
- Top Adjust Configuration: User-friendly “Top Adjust” system enables quick and comfortable adjustment of tappet and nozzle from the top, even during operation.
- Integrated Nozzle Heating: Built-in heating for the Fluid Box Body ensures constant optimal temperature and stable dispensing results.
- Electronics Manufacturing: Jet dispensing of media, including solder pastes, fluxes, conductive adhesives, etc., for PCBs, microchips, sensors, and fine-pitch components.
- Consumer Electronics: Accurate application of adhesives, sealants, and conductive materials for compact, high-density assemblies such as smartphones, wearables, and display modules.
- Pharmaceutical Manufacturing: Application of media in small volumes in device assembly and packaging processes, where repeatability and controlled dosing are critical.
- Automation: High-speed, repeatable micro-dispensing in automated production lines, ensuring consistent material application.
- Mechanical Engineering: Controlled dispensing of lubricants, bonding agents, and functional coatings on complex or precision components, even with varied geometrical surfaces.
Engineered for a wide range of low to high-viscosity materials, including:
- SMT Adhesives
- Conductive and Silver-Filled Glues
- Solder Pastes and Fluxes
- Silicones
- LED Phosphor Materials
- Underfill Materials
- Hot Melts
