Microdispensing System – MDS 3250⁺FC
High-speed piezo microdispensing system with Top Adjust for easy configuration
for jetting media from low to high viscosity in sophisticated industrial applications.
The MDS 3250+FC delivers ultra-precise, contact-free dispensing for viscosities up to 2,000,000 mPas. Powered by high-speed piezo technology, it ensures reproducible results across demanding industrial applications. With fast “Top Adjust” configuration and exceptional flexibility, it is one of the most powerful jetting valves in the industry.
| Dispensing quantity | Minimum 0.8 nL per pulse (depending on media) |
| Dispensing viscosity | Up to 2,000,000 mPas |
| Supply pressure | 1 - 8 bar (rel.), max. 100 bar (only when pressure tank is used) |
| Frequency | Up to 3,000 Hz (depending on application and media) |
| Technology | Piezoelectric Technology |
| Ambient temperature | 10 °C - 50 °C |
| Optional Heating system | Regulated nozzle heating: 180 °C (higher upon request) |
| Standard interface | RS 232 C; 24 V/5 V PLC, AUX |
| Valve type | Top Adjust, Normally Open |
| Dimension | Valve MDV 3250+FC: 92.1 mm H x 41.5 mm W x 36.5 mm D (incl. air cooler) Control unit MDC 3290+: 128 mm H x 102 mm W x 173 mm D (without cables), for installation in 19" racks |
| Weight | Valve: 250 g, Controller: 1350 g |
| Power connection | 110/230 V AC, 50/60 Hz power socket (back side) |
- High-speed piezo technology: Ultra-fast valve opening and closing cycles maximize throughput
- Outstanding repeatability: Delivers precisely reproducible results for stable, high-yield manufacturing processes
- Fine-tuned process control: Top Adjust enables extremely precise mechanical calibration for optimized jetting
- Flexible integration: Modular system design supports customized configurations and seamless integration into automated production lines
- Able to dispense on complex geometries: Ideal for cavities, grooves, and irregular or delicate surfaces
- Electronics manufacturing: Dispensing of adhesives, sealants, and other media onto various components
- Semiconductor packaging: Nano to sub-nano dot placement for underfill, encapsulation, and micro-scale bonding processes
- Microelectronics assembly: Accurate jetting of conductive pastes, adhesives, and protective materials on compact assemblies
- Consumer electronics: High-speed, repeatable dispensing for miniaturized and high-density devices
- Fully automated production lines: Optimized for rapid setup, fast changeovers, and consistent process stability
The MDS 3250+FC system incorporates a vastly efficient piezo actuator that leads to higher stroke and force, and makes this valve particularly suitable for high and highest viscous media such as,
- SMT Adhesives
- Silicones
- LED-phosphor
- Underfill materials
- Oils & Greases
- Hot Melts
- Flux Material or
- Solder Pastes
