Skip to main content

 

Market-specific solutions

We concentrate on your industry & application

 

 

 

"Every customer has specific needs and wishes,

we acknowledge them."

 

 

With our comprehensive knowledge,
we can offer you the best and most appropriate microdispensing products, services,
and solutions that are perfectly tailored to your production process. 

Industries

We serve a vast range of industries with our dispensing applications

Automotive >

Automotive Industry

The automotive industry uses the VERMES Microdispensing Systems of the model lines MDS 3280+ and MDS 3250+FC mainly in the car electronics production.

This includes:
- roof manufacturing
- door coverings
- camera module manufacturing
- manufacturing of window lifts.

The main advantages of the VERMES Microdispensing Systems stem from the versatile usability including the very powerful dispensing valves and from the ability to dispense large numbers of very small and precise dots in a very short time – in other words, high speed even for very precise applications.

 

Consumer Electronics >

Consumer Electronics Industry

The consumer electronics industry uses several VERMES Microdispensing product lines. This includes the MDS 1000 Series that is based on the unique DST - Dynamic Shockwave Technology.

The industry relies also on the models of the MDS 3000 Series (mostly MDS 3280+, MDS 3200+CP or MDS 3200+-AC) which are used f.e. to grease safety switches with very high viscous grease or to dispense conductive paste onto thermocouples.

Other usages include fixing of inductor wires, automatical bonding of anchor plates, magnetical fixing in the electric motor manufacturing and ferrite bonding.

In gadget and in mobile production hot melt dispensing is one of the major production parts that is usually performed with the MDS 3280+ Hot Melt System.

The extraordinary power of the piezo-based sytems and the outstanding actuator principle of the DST-based systems both offer a z-axis independant dispensing with its advantages.

 

 

 

Semiconductor >

Wafer and Semiconductor Industry

The wafer and semiconductors industry relies on the models of the MDS 3000 Series.  In the semiconductor industry, the VERMES Microdispensing Systems of the model lines MDS 3280,  MDS 3250FC and MDS 3200are often used for underfill applications.

The main advantage of these dispensing systems stems from the freedom in design. The special nozzle geometries allow the dispensing valves to reach the components to be underfilled with particularly high precision.

This enables an optimal package design due to the minimal distance between the chips.

 

 

Optoelectronics >

Optoelectronics Industry

In optoelectronics the VERMES Microdispensing Systems are employed in the manufacturing of applications such as automatic access control systems, telecommunications, medical equipment, and more.

In the LED (Light Emitting Diode) industry, for example the MDS 3000 series is used to dispense silver conductive adhesives to bond chips.

The valves have the advantage of being able to dispense a large number of small, precise dots in a short amount of time. The systems are also used for the socketing of filled and unfilled silicones of the already connected chips.

The main advantages stem from the high output with maximum precision.

 

Photovoltaics >

Photovoltaics / Solar Cells

In the solar cells and photovoltaics industry our VERMES Microdispensing Systems of the piezo-based model line MDS 3280 and of the DST (Dynamic Shockwave Technology) based model line MDS 1560 are used to dispense silver conductive adhesives and to bond contact bands.

The main advantage of these dispensing systems stems from the reduced amount of glue materials to be used and the high precision and performance that they achieve.

 

Medical/Pharmaceutical >

Medical and Pharmaceutical Industries

In the fields of medical technology and pharmaceutics the VERMES Microdispensing Systems offer a perfect solution for low to medium viscosity applications.

The systems of the MDS 3050 Series are used for a wide range of applications including life science, medical diagnostics, pharmaceuticals, e.g. anerobics, water-based cell and protein solutions.

They are for example dispensing enzyme solutions onto blood sugar test strips.

The major advantage of these dispensing systems stems from the maximum precision even when dispensing only very small amounts of the medium.

 

 

Precision Mechanics >

Precision Mechanics Industry

In the watch and precision mechanical industry the VERMES Microdispensing Systems of the model lines MDS 3050 and MDS 3280 are used to dispense synthetical precision mechanical oils onto bearings and shaft journals in mechanical watches.

The main advantage of the VERMES Microdispensing systems stems from the possibiltiy to dispense very small drops of grease, oil or glue contact-free with precise control of the exact amounts of dispense medium.

 

RFID >

 

RFID Industry

In the RFID industry (Radio-frequency identification) VERMES Microdispensing Systems of the model line MDS 3000 and or MDS 1000 are used to bond RFID chips to tags.

With highest speed and reliability the VERMES dispensing systems allow to reach the desired output of the small RFID components for each machine.

The main advantage of the VERMES microdispensing systems stems from their robustness, which is caused by the extraordinary power of the Piezos or the DST (Dynamic Shockwave Technology), the z-axis independent dispensing and the low total cost of ownership (TCO).

 

Industrial Electronics >

Industrial Electronics

In the electronics industry the VERMES Microdispensing Systems of the model line MDS 3250 and MDS 3280 are used to grease safety switches with very high viscous grease or to dispense conductive paste onto thermocouples.

Other usages include fixing of inductor wires, automatical bonding of anchor plates, magnetical fixing in the electric motor manufacturing and ferrite bonding. The main advantage of the VERMES microdispensing systems stems from their versatility.and the z-axis independant dispensing.

For Surface Mounted Technology - SMT the VERMES Microdispensing Systems of the low and medium viscosity model lines and for the high and highest viscosity model lines are used to aid the assembly in the conductor plate manufactoring, to dispense conductive adhesives (silver, nickel…) and other SMT adhesives, to encapsulate parts, to underfill chips, for conformal coating on the board, for Dam & Fill, Flip Chip, COB and many other processes.

The main advantage of our dispensing systems in all these cases stems from the possibility of very powerful dispensing of precise dots with high speed.

Applications

We support you with:
- thorough analysis of your dispensing application
- technical consultation and support
- individual operator trainings
- intensive guidance during the whole process
- specific and competent maintenance service

Dispensing different media exact, fast and contact free with the well established microdispensing valves from VERMES Microdispensing. Our innovative dispense technologies are continuously improved and enhanced by our research and development team. 

Solder Paste Dispensing with the VERMES MDS 1560 - DST System

At VERMES Microdispensing, we extensively study the behaviour of various solder pastes and adapt our systems to achieve the best possible solution for our customers’ applications. With the MDS1560 - powered by DST dynamic shockwave technology VERMES Microdispensing offers a solution to reliably dispense Solder Pastes from Type 5 onward.

Hot Melt Dispensing with the VERMES MDS 3280 Series

The VERMES Microdispensing Hot Melt System is an optimal solution for the dispensing of polyurethane-based hot melt adhesives. In combination with the cartridge heater and nozzle heater the system can precisely adjust to the requested temperature. The exceptionally fast piezo actuator is operated with extremely fast opening and closing cycles . The precise valve stroke and force dispenses hot glue in ultra-fine dots/lines.

Application Examples - exact dispensing of liquids -

 
Adhesion>

Adhesion

The bonding technique gluing becomes more and more important within the field of electronics. The tendency to miniaturize modules, devices and end products is the main reason. Adhesives are suited ideally to bond different materials in small spaces - and to do it fast, secure, durable and cheap. The flip chip technology is a prime example.

  • Anaerobics
  • UV Curing Adhesives
  • Cyanoacrylates
  • Electrically Conductive Adhesives
  • Thermal Conductive Adhesives
  • Hot Melt Adhesives

Anaerobic Adhesives

AdhesiveExample applicationRecommended microdispensing system
DELO-MS-DB135Fixing of metallic componentsMDS 3050 anaerobic / MDS 1560 anaerobic
DELO-ML 5302Sealing of thread connectionsMDS 3050 anaerobic
Loctite 648Fixing of metallic componentsMDS 3050 anaerobic / MDS 1560 anaerobic
Loctite 661Fixing of metallic componentsMDS 3050 anaerobic / MDS 1560 anaerobic

 

UV Curing Adhesives

AdhesiveExample applicationRecommended microdispensing system
Loctite 3103Bonding of plasticsMDS 3050
Loctite 3105Bonding of plasticsMDS 3050
Loctite 3106Bonding of plasticsMDS 3050
OrmocompGlueing in space of micro lensesMDS 3050
DELO-Katiobond 4578Sealing and fixing of electronic componentsMDS 3050
DELO-Photobond PB437Glueing of displaysMDS 3050

Cyanoacrylates

AdhesiveExample applicationRecommended microdispensing system
Kisling Ergo 5901Attaching very fine structuresMDS 3050
Loctite 4062Bonding of MetalsMDS 3050
Loctite 406Bonding of plasticsMDS 3050
Loctite 438Bonding of plasticsMDS 3050
Loctite 4304Bonding of plasticsMDS 3050

Conductive Adhesives

Electrically Conductive Adhesives

AdhesiveExample applicationRecommended microdispensing system
Sumitomo CRM1033bFixing of electronic componentsMDS 3200, MDS 3250+, MDS 3280
Emerson & Cuming WCA 20614-30BFixing of electronic componentsMDS 3200, MDS 3250+, MDS 3280
Emerson & Cuming CE3103 WLVFixing of electronic componentsMDS 3200, MDS 3250+, MDS 3280
Emerson & Cuming CE3103WZVGlueing of displaysMDS 3200, MDS 3250+, MDS 3280
EPO-TEK H20E-PFCFixing of semiconductor chipsMDS 3200, MDS 3250+, MDS 3280
EPO-TEK H20E-SFixing of semiconductor chipsMDS 3200, MDS 3250+, MDS 32800
Hysol Eccobond CA3556HFFixing of electronic componentsMDS 3200, MDS 3250+, MDS 3280
Hysol QMI 529HTFixing in place of electronic componentsMDS 3200, MDS 3250+, MDS 3280
Ablebond 84-1AFixing in place of electronic componentsMDS 3200, MDS 3250+, MDS 3280

 

Thermal Conductive Adhesives

AdhesiveExample applicationRecommended microdispensing system
Panacol Elecolit 601Bonding of heatsinks onto electronic circuitsMDS 3200+, MDS 3250+,
MDS 3280
Heraeus PD 955 PYFixing of electronic componentsMDS 3200+, MDS 3250+,
MDS 3280
DELO Monopox MK096Fixing of electronic componentsMDS 3200+, MDS 3250+,
MDS 3280
Loctite 3609Fixing of electronic componentsMDS 3200+, MDS 3250+,
MDS 3280
Loctite 3629Fixing of electronic components on PCB substrateMDS 3200+, MDS 3250+,
MDS 3280

Hot Melt Adhesives

AdhesiveExample applicationRecommended microdispensing system
3M Plastic Bonding Adhesive 2665Bonding of plasticsMDS 3200+, MDS 3250+,
MDS 3280
 
Aqueous >

Aqueous Solutions

SolutionExample applicationRecommended microdispensing system
Glucose oxidaseDispensing of sensor materialMDS 3050
Agarose dissolved in waterImmersion microscopyMDS 3050
InkMarking of good or badMDS 3050

Profit from first class microdispensing systems and take advantage of our superior technology. Let us show you their advantages. We are your professional partner, where the ideal solution for your dispensing process is concerned.

  • No damages thanks to contact free dispensing
  • Exact, precise dispensing of smallest drops from 0,4 nanoliter up to several microliters
  • Z-axis independant dispensing, even on uneven substrates (boards, hybrids, chips)
  • Selectable shot frequency helps to avoid satellites
  • You save time since you are independant of the z-axis, thanks to the contactfree dispensing
  • Perfect adaptation of the valve to the dispense medium, thanks to software based programming of the tappet movement
  • Precise drop forms and high repeatability of the process

 

 
Flux >

Flux

Flux materialExample applicationRecommended microdispensing system
Soldering FluxRepair of solder jointsMDS 3200+, MDS 3250+,
MDS 3280
Multicore LFRepair of solder jointsMDS 3200+, MDS 3250+,
MDS 3280
Heraeus Flux Repair of solder jointsMDS 3200+, MDS 3250+,
MDS 3280

Profit from first class microdispensing systems and take advantage of our superior technology. Let us show you their advantages. We are your professional partner, where the ideal solution for your dispensing process is concerned.

  • No damages due to contact-free dispensing
  • Exact, precise dispensing of smallest drops from 0.4 nanoliter up to several microliters
  • Z-axis independant dispensing, even on uneven substrates (boards, hybrids, chips)
  • Selectable shot frequency avoida satellites
  • Time saving
  • Perfect adaptation of the valve to the dispense medium with software based programming of tappet movement
  • Precise drop forms and highest process repeatability

 

 

 
Lacquer>

Lacquers

LacquerExample applicationRecommended microdispensing system
Peters Elpeguard 1706 FLZSpraying on as protective lacquerMDS 3050 with spray add-on
Peters Elpeguard SL 1309 NSpraying on as protective lacquerMDS 3050 with spray add-on
Peters SD 2692 TSpraying on as protective lacquerMDS 3050 with spray add-on
Elantas Bectron PL    4122-TSpraying on as protective lacquerMDS 3050 with spray add-on

Profit from first class microdispensing systems and take advantage of our superior technology. Let us show you their advantages. We are your professional partner, where the ideal solution for your dispensing process is concerned.

  • No damages due to contact-free dispensing
  • Exact, precise dispensing of smallest drops from 0.4 nanoliter up to several microliters
  • Z-axis independant dispensing, even on uneven substrates (boards, hybrids, chips)
  • Selectable shot frequency helps to avoid satellites
  • Time saving
  • Perfect adaptation of the valve to the dispense medium with software based programming of tappet movement
  • Precise drop forms and highest process repeatability

 

 
Oil & Grease >

Oils and Greases

Oil/greaseExample applicationRecommended microdispensing system
Dr. Twilich K4563/100Grease in the precision mechanics industryMDS 3050
Klüber Isoflex Toplas L 32Grease for the automotive industryMDS 3050
Klüber ASONIC GHY 72Grease for various applicationsMDS 3050
Klüber Amblygon TA 30/1Grease for various applicationsMDS 3050
Klüber ISOFLEX LDS 18 Special AGrease for various applicationsMDS 3050
Klüber Constant OY220Grease for sintered metalsMDS 3050
Moebius Synt-HP 500Grease in the precision mechanics industryMDS 3050
Moebius Synt-A-LubeGrease in the precision mechanics industryMDS 3050

Profit from first class microdispensing systems and take advantage of our superior technology. Let us show you their advantages. We are your professional partner, where the ideal solution for your dispensing process is concerned.

  • No damages due to contact-free dispensing
  • Exact, precise dispensing of smallest drops from 0.4 nanoliter up to several microliters
  • Z-axis independant dispensing, even on uneven substrates (boards, hybrids, chips)
  • Selectable shot frequency helps to avoid satellites
  • Time saving
  • Perfect adaptation of the valve to the dispense medium with software based programming of tappet movement
  • Precise drop forms and highest process repeatability
 
Silicone >

Silicones

SiliconeExample ApplicationRecommended microdispensing system
Dow Corning OE-6636 Optical EncapsulantSocketing of LED materialsMDS 3200+, MDS 3250+,
MDS 3280
Dow Corning 6-250 ElastomerFixing of componentsMDS 3200+, MDS 3250+,
MDS 3280
Wacker AK 350Used as lubricantMDS 3200+, MDS 3250+,
MDS 3280
Wacker Elastosil E4Sealing of componentsMDS 3200+, MDS 3250+,
MDS 3280

Profit from first class microdispensing systems and take advantage of our superior technology. Let us show you their advantages. We are your professional partner, where the ideal solution for your dispensing process is concerned.

  • No damages due to contact-free dispensing
  • Exact, precise dispensing of smallest drops from 0.4 nanoliter up to several microliters
  • Z-axis independant dispensing, even on uneven substrates (boards, hybrids, chips)
  • Selectable shot frequency helps to avoid satellites
  • Time saving
  • Perfect adaptation of the valve to the dispense medium with software based programming of tappet movement
  • Precise drop forms and highest process repeatability

 

 
Underfill >

Underfills

Underfill materialExample applicationRecommended microdispensing system
Hitashi CEL-C-3720Underfilling of electronic componentsMDS 3200+, MDS 3250+, MDS 3280
Indium Corporation NF260Placing and underfilling of electronic componentsMDS 3200+, MDS 3250+, MDS 3280
Namics U84391-1Underfilling of electronic componentsMDS 3200+, MDS 3250+, MDS 3280
Hysol FF2300Coating of electronic componentsMDS 3200+, MDS 3250+, MDS 3280
Hysol FP4654Damming and filling of electronic componentsMDS 3200+, MDS 3250+, MDS 3280
Loctite 3549Underfilling of electronic componentsMDS 3200+, MDS 3250+, MDS 3280
Loctite 3593Underfilling of electronic componentsMDS 3200+, MDS 3250+, MDS 3280

 

Profit from first class microdispensing systems and take advantage of our superior technology. Let us show you their advantages. We are your professional partner, where the ideal solution for your dispensing process is concerned.

  • No damages due to contact-free dispensing
  • Exact, precise dispensing of smallest drops from 0.4 nanoliter up to several microliters
  • Z-axis independant dispensing, even on uneven substrates (boards, hybrids, chips)
  • Selectable shot frequency helps to avoid satellites
  • Time saving
  • Perfect adaptation of the valve to the dispense medium with software based programming of tappet movement
  • Precise drop forms and highest process repeatability

 

GET IN TOUCH WITH US

VERMES Microdispensing GmbH

Rudolf-Diesel-Ring 2
83607 Holzkirchen
Deutschland
Phone: +49 (0)8024 644-0
info@vermes.com

VERMES Microdispensing
(Xiamen) Co., Ltd.
Office 601-C1, Rihua Int. Building, No.16
Xinfeng 3rd Road, Torch Hi-Tech Park
Huli district, 361000 Xiamen City
PR China
Phone: +86 (0)592-7257233
info@vermes.com

VERMES Microdispensing
America Inc
2226 Ringwood Ave
San Jose, CA 95131
USA
Phone: +1 408 520-2555
america@vermes.com

VERMES Microdispensing
(Malaysia) Sdn Bhd
No.11, Jalan Sungai Dua Utama 1
Taman Sungai Dua Utama
13800 Butterworth, Penang
Malaysia
Phone: +60 4 358 0996
info@vermes.com

VERMES Microdispensing Ltd.

#505, Bucheon TechnoPark 402,
655, Pyeongcheon-Ro, Bucheon-Si,
Gyeonggi-Do, Korea
Phone: +82 (0)32-246-1500
korea@vermes.com