Microdispensing System – MDS 1560 Hot Melt
Specially designed for dispensing hot glue (also known as hot melt adhesive),
the system is an optimal solution for dispensing polyurethane-based hot-melt adhesives.
Hot melt is a thermoplastic adhesive that changes its solid state to liquid when passing through the zones of increasing temperature. Hot melt applications are getting more and more popular in electronic industry, e.g., for bonding smartphone displays.
| Heating components | 2 separate heating channels (Cartridge, Hose / Fluid Box Body) |
| Power | 145 W (Cartridge 100 W; Nozzle heating 45 W); 40 W Valve |
| Max. temperature (Hot Melt) | 230 °C (achieved through heater controller) |
| Frequency | ~ 500 Hz continuous frequency, max. 700 Hz |
| Technology | Powered by DST Technology |
| Actuator pressure | 1.5 - 8 bar |
| Cartridge pressure | 0.1 - 10 bar (rel.) |
| Dimension (Hot Melt + Valve + Fluid Box) | 160 mm H x 46 mm W x 153 mm D |
| Weight (Hot Melt + Valve + Fluid Box) | 1,100 g |
| Power connection | MDV 1560: 24 V DC / 4 A Hot melt: 48 V DC / 4 A |
- Recommended for Hot Melt applications: Engineered specifically for precise dispensing of thermoplastic hot glue, including polyurethane-based hot melts
- Advanced heating control: Cartridge heater and nozzle heater ensure accurate, stable temperature management for optimal adhesive performance
- Complex pattern dispensing: Supports programmable patterns like drop-on-drop and drop-on-fly for advanced bonding designs
- Clean, accurate cutoff: Sharp start/stop performance makes it ideal for intermittent adhesive coating without stringing or smearing
- Protects media quality: Optimized thermal management and humidity control help extend hot melt media life
- Dam & Fill processes: Ideal for Very High Dam (VHD) applications requiring precise material containment and filling
- PCB & 3D MID assembly: Controlled adhesive application on printed circuit boards and molded interconnect devices
- Complex Bonding patterns: Applications requiring programmable geometries and multi-dot structures
- General Industrial Hot Melt Applications: Compatible with major adhesive brands such as 3M, Henkel, and H.B. Fuller
- Electronics Manufacturing: Precision bonding of smartphone displays, electronic modules, and compact devices
The system provides a perfect solution for all types of hot melt adhesives mentioned, including but not limited to the following.
- PUR (polyurethane reactive) - hot melt
- PVA (polyvinyl alcohol) - hot melt
- Reactive & non-reactive hot melt
- Wax (solid)
- Low melting point metals, e.g., Gallium (Ga)
