Add-on system - Hot Melt
Retrofit system for precise dispensing of hot melt adhesives in applications such as coating, encapsulation, spraying, and many more.
Hot Melt, as a add-on, is designed to be compatible with various VERMES systems and to extend their capabilities.
Engineered for precision, speed, and durability, it is ideally suited for the rigorous demands of semiconductor, electronics, automotive, and other advanced manufacturing sectors.
- Seamless integration: Easy to retrofit onto the existing valve system for hot melt adhesive dispensing.
- High-temperature capability: Ideal for adhesives that require high temperatures (up to 230 °C).
- Improved media cost efficiency: Reduced adhesive waste, less downtime, longer media life.
- High throughput: Delivers consistent, accurate dots at high speed.
- Reliable performance under stress: Designs for thermal stability, material compatibility, and low maintenance.
Recommended Media & Applications
- Types of Adhesives: Polyurethane-based hot melt adhesives - PUR, PVA (polyvinyl alcohol), reactive & non-reactive hot melts, paraffin, wax, gallium, etc.
- Industries and Applications:
- Electronics (bonding of displays, smartphones, 3D MID, PCB assembly)
- Automotive (sensor module bonding, connectors, sealing)
- Semiconductor and micro-electronics (fine dots, lines, dam & fill, complex patterns)
- Consumer devices and display technology
