Application Support for Precision Microdispensing Solutions
Our application services provide complete support for achieving precise, fast, and contact-free dispensing results across a wide range of industries. From thorough analysis of your dispensing requirements to technical consultation, customized operator training, and continuous process guidance, we ensure optimal performance at every stage.
Our advanced microdispensing technologies are constantly refined through ongoing research and development, while our specialized maintenance services help maintain long-term reliability and efficiency for your production processes.
Find your Application
Grease & Oil Dispensing
Precise, contact-free application of greases and oils is essential wherever tight tolerances require exact fits and defined sliding properties.
- Consumer Electronics - Adhesive and lubricant dosing for voice coil motors (VCMs) and optical lens assemblies in cameras and smartphones
- Medical Technology - Adhesive dispensing on miniaturized components in pacemaker manufacturing, under cleanroom conditions
- Automotive / PCB Assembly - Dispensing adhesives on various components in SMT lines for vibration resistance and environmental protection
Dispensing of Solder Paste
Reliable, volumetrically accurate solder paste application from fine-pitch Type 5/6 pastes to standard SMT pads, without compromising electrical performance.
- Prototype & Small-Batch PCB - Flexible, component pad soldering for prototype products
- SPI Correction - Automated dispensing of missing or insufficient solder deposits after SPI machine dispensing
- SMT & Advanced Packaging - Consistent deposit quality for high-density BGA, and fine-pitch dispensing
Dispensing of Adhesive
VERMES is your reliable partner for the precise dispensing of a wide variety of adhesives, for every bonding application, every material, and every requirement.
- Semiconductor / LED - Silver epoxy used for attaching the LED chip onto the substrate
- Automotive / E-Mobility - Adhesive bonding in EV and battery module assembly
- Medical Technology - Adhesive dispensing onto miniaturized components during pacemaker manufacturing under cleanroom conditions.
- Consumer Electronics - Drive unit assembly and diaphragm bonding in miniature audio components (e.g., speakers, microphones)
Encapsulation
Embedding active components in protective material for guarding against mechanical stress, moisture, and electrical interference to extend component lifetime.
- EV / Battery Modules - Hot melt encapsulation of battery cells and modules for vibration resistance and thermal protection
- Automotive / Electric Motors - Motor coil encapsulation for electrical insulation and long-term operational reliability
- SMT Industry / Glob Top - Component encapsulation in industrial equipment with SMT Glue for the protection from harsh conditions
Coating & Sealing Application
Protecting components and connections from moisture, chemicals, dust, and pressure with the precise application of glues without contaminating adjacent surfaces.
- Automotive / Hydraulic & Pneumatic Systems - Thread sealant application for leak-free, pressure-resistant connections
- Automotive / EV / Battery Cells - Protective coating against moisture ingress and mechanical damage
- Semiconductor - Silver epoxy conformal coating for DIE base layer formation
- Consumer Electronics - UV adhesive dispensing for OLED edge sealing
Dispensing of Sinter paste and Thermal Interface Material
VERMES precisely dispenses sintering and thermal conductive pastes to ensure efficient heat dissipation in miniaturized electronic components. This reduces thermal stress and extends the service life of the components.
- EV / Battery Modules - Thermally conductive adhesive dispensing between battery cells and cooling plates for uniform heat dissipation
- Semiconductor / Bond Wire Protection - Non-conductive media dispensing around bond wires for simultaneous electrical insulation and thermal dissipation