Any Questions?

VERMES Microdispensing GmbH

Palnkamer Str.18
83624 Otterfing
Germany
Phone: +49 (0)8024 644 - 0
E-Mail: info(a)vermes.com

VERMES Microdispensing
America Inc

2226 Ringwood Ave.
San Jose, CA 95131
USA
Phone: +1 408 520-2555
E-Mail: america(at)vermes.com

VERMES Microdispensing
(Xiamen) Co., Ltd.

Room 601/C1, Rehua Building, No.16
Xinfeng 3rd Road, Huoju Hi-Tech Zone
Huli district, Xiamen City
PR China
E-Mail: info(at)vermes.com

VERMES Microdispensing
(Malaysia) Sdn Bhd

No.11, Jalan Sungai Dua Utama 1
Taman Sungai Dua Utama
13800 Butterworth, Penang
Malaysia
Phone: +60 4 358 0996
E-Mail: info(at)vermes.com

Hot Melt Dispensing System

The Hot Melt Dispensing System from VERMES Microdispensing has been specially designed for dispensing hot glue, also known as hot melt adhesive.

  • Perfect Solution for all types of Hot Melt Applications
  • Designed for Hot Glue Adhesives Dispensing
  • Ideal for Electronic Manufacturing
  • Freely adjustable Parameter Settings
  • Complex Pattern Dispensing Options
  • Highest Media Life Preservation

Hot melt is a thermoplastic adhesive that changes its solid state to liquid when passing through the zones of increasing temperature.

Hot melt applications are getting more and more popular in electronic industry, e.g. for bonding smart phone displays.

 

Major Advantages:

The VERMES Microdispensing Hot Melt System is an optimal solution for the dispensing of polyurethane-based hot melt adhesives.

In combination with the cartridge heater and nozzle heater the system can precisly adjust to the requested temperature.

Due to the exceptionally fast piezo actuator the dispensing valve is operated with extremely fast opening and closing cycles. The precise setting of stroke and force enable to dispense hot glue in ultra-fine dots/lines with a width down to 200 μm.

Freely adjustable parameter settings facilitate the customization of the jet properties to the respective requirements and fluid properties. The electronic control unit allows the change of the dispensing parameters without delay.

The hot melt cartridge cylinder reduces heating up time and cartridge changing time to receive optimum heating and humidity adjustments and optimized preservation of hot melt life.

Recommended Media:

The system provides a perfect solution for all types of hot melt adhesives, for example 3M, Henkel, Fuller glues. 

Application Examples:

  • The system is ideal for the electronic industry, e.g. for bonding electronic gadgets, smart phone components, 3D MID (Molded Interconnect Device) and PCB (Printed Circuit Board).
  • It is also perfect as Dam and Fill dispensing techniques for VHD (Very High Dam) applications.
  • The variously programmable controller allows to dispense complex patterns, such as drop-on-drop and drop-on-fly dispensing.
  • The precise cutoff and accurate dispensing makes it a preferred solution for intermittent adhesive coating applications.

Any Questions?

VERMES Microdispensing GmbH

Palnkamer Str.18
83624 Otterfing
Germany
Phone: +49 (0)8024 644 - 0
E-Mail: info(a)vermes.com

VERMES Microdispensing
America Inc

2226 Ringwood Ave.
San Jose, CA 95131
USA
Phone: +1 408 520-2555
E-Mail: america(at)vermes.com

VERMES Microdispensing
(Xiamen) Co., Ltd.

Room 601/C1, Rehua Building, No.16
Xinfeng 3rd Road, Huoju Hi-Tech Zone
Huli district, Xiamen City
PR China
E-Mail: info(at)vermes.com

VERMES Microdispensing
(Malaysia) Sdn Bhd

No.11, Jalan Sungai Dua Utama 1
Taman Sungai Dua Utama
13800 Butterworth, Penang
Malaysia
Phone: +60 4 358 0996
E-Mail: info(at)vermes.com

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