Any Questions?

VERMES Microdispensing GmbH

Palnkamer Str.18
83624 Otterfing
Germany
Phone: +49 (0)8024 644 - 0
E-Mail: info(a)vermes.com

VERMES Microdispensing
America Inc

2226 Ringwood Ave.
San Jose, CA 95131
USA
Phone: +1 408 520-2555
E-Mail: america(at)vermes.com

VERMES Microdispensing
(Xiamen) Co., Ltd.

Room 601/C1, Rehua Building, No.16
Xinfeng 3rd Road, Huoju Hi-Tech Zone
Huli district, Xiamen City
PR China
E-Mail: info(at)vermes.com

VERMES Microdispensing
(Malaysia) Sdn Bhd

No.11, Jalan Sungai Dua Utama 1
Taman Sungai Dua Utama
13800 Butterworth, Penang
Malaysia
Phone: +60 4 358 0996
E-Mail: info(at)vermes.com

Adhesion

The bonding technique glueing becomes more and more important within the field of electronics. The tendency to miniaturize modules, devices and end products is the main reason. Adhesives are suited ideally to bond different materials in small spaces - and to do it fast, secure, durable and cheap. The flip chip technology is a prime example.

Any Questions?

VERMES Microdispensing GmbH

Palnkamer Str.18
83624 Otterfing
Germany
Phone: +49 (0)8024 644 - 0
E-Mail: info(a)vermes.com

VERMES Microdispensing
America Inc

2226 Ringwood Ave.
San Jose, CA 95131
USA
Phone: +1 408 520-2555
E-Mail: america(at)vermes.com

VERMES Microdispensing
(Xiamen) Co., Ltd.

Room 601/C1, Rehua Building, No.16
Xinfeng 3rd Road, Huoju Hi-Tech Zone
Huli district, Xiamen City
PR China
E-Mail: info(at)vermes.com

VERMES Microdispensing
(Malaysia) Sdn Bhd

No.11, Jalan Sungai Dua Utama 1
Taman Sungai Dua Utama
13800 Butterworth, Penang
Malaysia
Phone: +60 4 358 0996
E-Mail: info(at)vermes.com