Adhesion

The bonding technique glueing becomes more and more important within the field of electronics. The tendency to miniaturize modules, devices and end products is the main reason. Adhesives are suited ideally to bond different materials in small spaces - and to do it fast, secure, durable and cheap. The flip chip technology is a prime example.

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VERMES Microdispensing GmbH
Palnkamer Str. 18
83624 Otterfing, Germany
Telephone: +49 (0) 8024 644 0
E-Mail: sales(at)vermes.com